Standard and Device-Specific Integration
Our mmWave packages deliver high-performance surface mount (SMT) integration for millimeter wave systems. Choose from standard mmWave packages or device-specific designs tailored for MMIC integration. Leveraging proprietary PolyStrata® technology, these compact solutions enable low-loss signal routing, precise impedance control, and wire bonded MMIC integration while maintaining excellent thermal performance.
Engineered for High-Frequency RF/mmWave Performance
- Standard & Device-Specific Options — Choose from standard packages or custom designs for specific devices
- High-Performance Surface Mount (SMT) — Compact mmWave packages simplify high-frequency system integration
- Low-Loss Signal Integrity — PolyStrata® technology minimizes parasitics and maintains signal fidelity
- Wire Bonded MMIC Integration — Air-cavity designs support high-performance device packaging
- Thermally Efficient Copper Construction — High thermal conductivity supports reliable operation
Key Applications
Our Standard RF/mmWave Packages
| Product Name | Frequency (Ghz) | Insertion Loss (AB) | Return Loss (AB) | Max Die Size (L x W x D) | Package Size (L x W x D) | DC Pins | Lid # | Data Sheet | Buy |
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| PolyStrata® Package: PSP1028107 | 55 - 90 | 0.6 dB | 1028940-004 |
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| PolyStrata® Package: PSP1028108 | 55 - 90 | 0.6 dB | 1028940-003 |
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| PolyStrata® Package: PSP1028109 | 50 | 0.3 dB | 1028940-005 |
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| PolyStrata® Package: PSP1028111 | 50 | 0.3 dB | 1028940-003 |
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| PolyStrata® Package: PSP1028112 | 50 | 0.3 dB | 1028940-002 |
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Our Device-Specific RF/mmWave Packages
| Product Name | Matching Device | Manufacturer | Package Size (L x W x D) | Lid # | Data Sheet | Buy |
|---|---|---|---|---|---|---|
| PolyStrata® Package: PSP1029439 | TGA2962 | Qorvo | 1028940-009 |
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Design Filters With Strataworks® or Contact Our Team for Tailored Solutions
Explore Our Standard and Custom RF/mmWave Packages
Browse standard RF/mmWave packages or collaborate with our team to develop a device-specific solution optimized for performance, integration, and thermal requirements.