Market-leading lowest loss, surface mount form factor package for die under 3 x 3mm up to 50 GHz.
Nuvotronics presents a new state of the art Low Loss MMIC package. The PolyStrata® package complements integrated MMIC performance, with less than 0.3 dB insertion loss up to 50 GHz and with 15 dB typical return loss. The package can be surface mounted to a PCB using standard SMT processes. This increases the ease of manufacturing while maintaining superior performance in a smaller size compared to other packaging substrates.
