Our patented PolyStrata® technology, developed under the award-winning DARPA 3D MERFS program, allows us to design and fabricate 3D air-metal-dielectric structures with micron level tolerances. With this flexible system we can create RF devices, such as antennas, filters, combiners, and baluns, that outperform anything else on the market at a fraction of the size and weight. These can be combined into higher-level modules and subsystems such as phased arrays. The cube pictured in hand contains 4 baluns, 10 splitters, 24 interconnects and 16 feeds, clearly showing the incredible capabilities of PolyStrata architecture.
Our experienced team starts with world-class PolyStrata® architecture -based components and builds them into industry disrupting systems. With full design, assembly, and testing capability in-house, Nuvotronics delivers the highest quality from start to finish. Contact us today to see how PolyStrata architecture and Nuvotronics can solve your toughest problems.