The revolutionary PolyStrata® process—invented by Nuvotronics—creates the first ever 3D AirCoax miniaturized microwave and millimeter-wave networks. The technology delivers a compact, densely packed footprint never before seen in defense and aerospace. High isolation and "DC to Daylight" broadband capability make PolyStrata the chosen architecture for the next generation of radar and communications.
We stack and pack adjacent layers of highly isolated coaxial transmission lines that have air as the dielectric. The center conductor is supported by dielectric straps that do not inhibit performance of the AirCoax line—to 200GHz and beyond.
The PolyStrata architecture is a wafer-level process, meaning that networks, components, and antennas are made in batch, not singly milled or machined. This manufacturing method drives cost down while the complexity of the system goes up, such as in phased arrays or AESAs. We go from design to fab in a 6-12 week process, making new configurations a snap for complex modules. Design it all right on the mask, with embedded passives, combiners, filters, baluns and receptacles for MMICs.
At right is a typical build process. We use a standard flat substrate, wafer or panel, build up the structures layer by layer, and harvest the components and modules by releasing them from the substrate. If needed as part of the end product, modules can remain attached and integrated on the substrate. One more important fact: the substrate can be an active device wafer for direct integration to actives. We are currently running a 6" wafer process with plans to expand to 12" panels. Our fab runs are scheduled monthly.
For a general overview of the technology, please download our overview PDF. For information on how to get on a Nuvotronics PolyStrata build, please contact us and our sales staff will contact you promptly.